![]() Reduce time and/or temperature during preheat and soak stage of profileĮxcessive heat during preheat and soak causing flux to become exhausted before entering reflow stage, oxidized solder connections Too much heat applied during preheat and soak causing flux to become exhausted before reflow Reduce heating rate of reflow profile to no more than 2✬/second Heating rate of reflow profile too high causing flux within solder paste to splatter Verify peak temperature and time above liquidus during reflow. Temperature profile incorrect during reflow Store components within humidity cabinet or pre-bake before use, reduce heating rate within reflow profile. Heating rate of reflow profile set too high causing moisture trapped within component to expand during soldering Pre-bake PCB's before use to remove any excess moisture, consider using material with higher Tg rating, store PCB's in moisture cabinet.Ĭomponent flipped over in feeder during index function causing part to be picked and placed upside down.Ĭonsider alternative PCB supplier, pre-bake PCB's before use and consider using material with higher Tg rating, store PCB's in moisture cabinet. Using flat surface finish such as ENIG, check component parameters in placement machine, use enough solder paste or increase thicknessĬontamination under solder mask layer, moisture trapped within FR4 material expanding as PCB is heated. PCB surface finish not flat (HASL), component misplaced, not enough solder paste printed Revise design to either reposition via outside of component footprint or employ plug via Via placed within pad causing solder paste to flow away from pad and through hole during reflow. Contact us today to learn more about working together on your next project. we have over 25 years of experience manufacturing PCBs, PCBAs and providing engineering services to help you meet your quality standards and expectations. JIS Spread 88.6% on Entek HT OSP.Summarized below are some typical reflow / solder defects along with recommended corrections or preventative actions to improve your PCBA process and product quality. ![]() Excellent wetting characteristics on all common surface finishes (including Entek HT OSP).High Reflow Yield with IPC Class II Voiding Performance when used to solder BGA components.High spread/wetting lead free paste compatible with lead free alloys and surface finishes.Able to spread and wet using straight ramp or soak reflow profiles in air.Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features.Standard Type 3 solder paste contains 25-45 micron size.This product contains 96.5% Tin /3.0% Silver /0.5% Copper.WS-820 has excellent fine feature printing and an 8 hour stencil life. ![]() Yields class-leading wetting performance in ovens with ambient air.WS-820 was adapted from WS-819 to increase the reflow profile window.If you are looking for a solder paste with these specifications (96.5% Tin 3.0% Silver, and 0.5% Copper), this paste is one of the best! It is packed in a 500 gram jar and produces superior solder spread and shiny joints. In fact, it is one of the best solder pastes for electronics and gives you more bang for your buck! This high-quality solder paste is designed to meet the demands of electronics manufacturing as it provides exceptional performance and reliability. Elevate your soldering experience with WS-820! It is comprised of 96.5% Tin, 3.0% Silver, and 0.5% Copper Type 3 Powder, it's also halide-free. Enjoy outstanding fine feature printing and an impressive 8-hour stencil life. This Type 3 solder paste sets a new standard by minimizing solder voiding on BGA assemblies compared to other water-soluble options reflowed in air. Derived from the acclaimed WS-819, WS-820 extends the reflow profile window for even greater flexibility. Introducing Alpha Metals' SAC305 WS-820, a cutting-edge water-soluble lead-free solder paste engineered for exceptional wetting performance in ovens with ambient air. Introducing the Alpha Water-Soluble Solder Paste which is available in a convenient 500g jar! Lead-Free Wire Solder for Industrial Soldering Lead-Free Wire Solder for Electronic Assembly Lead-Free Solder Bar for Soldering & Tinning Electronics Lead-Free Solder Bar for Industrial Soldering & Tinning Solder Bar & Solder Wire - Leaded & Lead-Free
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